New insulation technique paves the way for more powerful and smaller chips

Leuven, Belgium (SPX) Sep 05, 2019 Researchers at KU Leuven and imec have successfully developed a new technique to insulate microchips. The technique uses metal-organic frameworks, a new type of materials consisting of structured nanopores. In the long term, this method can be used for the development of even smaller and more powerful chips that consume less energy. The team has received an ERC Proof of Concept grant to further

New insulation technique paves the way for more powerful and smaller chips

Researchers at KU Leuven and imec have successfully developed a new technique to insulate microchips. The technique uses metal-organic frameworks, a new type of materials consisting of structured ...

Wed 4 Sep 19 from Phys.org

New insulation technique paves the way for more powerful and smaller chips, Wed 11 Sep 19 from SpaceDaily

New insulation technique paves the way for more powerful and smaller chips, Wed 4 Sep 19 from ScienceDaily

New insulation technique paves the way for more powerful and smaller chips, Wed 4 Sep 19 from Eurekalert

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