Magnetic testing process helps ensure reliability of microelectronic devices

Thermal stress can cause debonding between thin layers in microelectronics. Taking advantage of the force generated by magnetic repulsion, researchers have developed a new technique for measuring the adhesion strength between thin films of materials used in these devices, and they hope to apply the method improve solar cells or microelectromechanical devices.

Magnetic testing process helps ensure reliability of microelectronic devices

(Phys.org) -- Taking advantage of the force generated by magnetic repulsion, researchers have developed a new technique for measuring the adhesion strength between thin films of materials used ...

Thu 12 Apr 12 from Phys.org

Magnetic Testing Ensures Quality of Microelectronics

Taking advantage of the force generated by magnetic repulsion, researchers have developed a new technique for measuring the adhesion strength between thin films of materials used in microelectronic ...

Fri 13 Apr 12 from Laboratory Equipment

Magnetic test technique helps ensure reliability of microelectronics, PV cells & MEMS, Fri 13 Apr 12 from e! Science News

Magnetic test technique helps ensure reliability of microelectronics, PV cells & MEMS, Fri 13 Apr 12 from ScienceDaily

Magnetic test technique helps ensure reliability of microelectronics, PV cells & MEMS, Fri 13 Apr 12 from Eurekalert

Test Technique Helps Improve Electronics Reliability, Thu 12 Apr 12 from Newswise

Magnetic testing process could deliver more reliable electronics

Thermal stress can cause debonding between thin layers in microelectronics. Taking advantage of the force generated by magnetic repulsion, researchers have developed a new technique for measuring ...

Fri 13 Apr 12 from R&D Mag

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