Magnetic testing process helps ensure reliability of microelectronic devices
Thermal stress can cause debonding between thin layers in microelectronics. Taking advantage of the force generated by magnetic repulsion, researchers have developed a new technique for measuring the adhesion strength between thin films of materials used in these devices, and they hope to apply the method improve solar cells or microelectromechanical devices.
Magnetic testing process helps ensure reliability of microelectronic devices
(Phys.org) -- Taking advantage of the force generated by magnetic repulsion, researchers have developed a new technique for measuring the adhesion strength between thin films of materials used ...
Thu 12 Apr 12 from Phys.org
Magnetic Testing Ensures Quality of Microelectronics
Taking advantage of the force generated by magnetic repulsion, researchers have developed a new technique for measuring the adhesion strength between thin films of materials used in microelectronic ...
Fri 13 Apr 12 from Laboratory Equipment
Magnetic test technique helps ensure reliability of microelectronics, PV cells & MEMS, Fri 13 Apr 12 from e! Science News
Magnetic test technique helps ensure reliability of microelectronics, PV cells & MEMS, Fri 13 Apr 12 from ScienceDaily
Magnetic test technique helps ensure reliability of microelectronics, PV cells & MEMS, Fri 13 Apr 12 from Eurekalert
Test Technique Helps Improve Electronics Reliability, Thu 12 Apr 12 from Newswise
Magnetic testing process could deliver more reliable electronics
Thermal stress can cause debonding between thin layers in microelectronics. Taking advantage of the force generated by magnetic repulsion, researchers have developed a new technique for measuring ...
Fri 13 Apr 12 from R&D Mag
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